One $2,500 scholarship is available to an undergraduate student in their sophomore or junior year, who is studying subjects in relation to synthesis and processing, structure, properties, and performance of electronic, photonic, magnetic, and superconducting materials as well as materials used in packaging, and interconnecting such materials in device structures. An additional $500 for travel expenses is available to the recipient in order to personally accept the award at the TMS Annual Meeting and Exhibition. The scholarship recipient is known as the FMD Gilbert Chin Scholar. Award recipients must travel to and attend the conference in order to receive the travel funds associated with this award. Relatives of members of the funding committee/division are not eligible. Submitted coursework must be relevant to the scholarship for which the student is applying. Access application form at the scholarship site. An individual statement describing unique educational experiences (e.g., special projects), career plans, leadership experience, involvement in a Material Advantage chapter, and community involvement. This statement should be no more than 200 words. The applicant must be a student member of Material Advantage. Applicants must be an undergraduate sophomore or junior enrolled full time in a metallurgical/materials science engineering program at a qualified college or university. The following should be submitted in order in a PDF format; accomplished application form as downloaded from the scholarship site, individual/personal statement, CV (optional), transcript (can be unofficial) and three letters of recommendation (TMS forms can also be found at the scholarship site). Send complete application package to email@example.com.
1st Financial Bank USA wants to celebrate those who recognize the importance of pursuing educational and financial goals with the 1st Financial Bank USA Financial Goals Scholarship.