Technical Association of the Pulp & Paper Industry (TAPPI)/TAPPI PLACE (Polymers, Laminations, Adhesives, Coatings and Extrusions) Scholarship

Awarded only in even numbered years, the TAPPI PLACE (Polymers, Laminations, Adhesives, Coatings and Extrusions) Scholarship is designed to encourage talented science and engineering students to pursue careers in the packaging industry and to develop awareness of the industry, and of the TAPPI Polymers, Laminations, Adhesives, Coatings, and Extrusions (PLACE) Division. Membership in a TAPPI Student Chapter is required.

Award Information

Award Amount
$4,000
Number of Awards
1
Application Deadline
February 14
Available to Class Level
Freshmen, Sophomores, Juniors, Seniors
Renewability
Not renewable

Eligibility Requirements

Minimum GPA Required
0
Ethnicity/Heritage
None specified
Residency
None specified
Gender
None specified
Religious Affiliation
None specified
Location of College
None specified
Area of Study
None specified
Financial Need
Financial need analysis is not required

Scholarship Sponsor

Organization
Member Engagement Manager
Technical Association of the Pulp & Paper Industry (TAPPI)
Address
15 Technology Parkway, South
City, State, Zip
Peachtree Corners, GA , 30092
Telephone
(770) 209-7246
E-mail
scholarships@tappi.org
Website
Website

Data Source: Peterson’s Private Financial Aid Database, copyright © 2020 Peterson’s LLC. All rights reserved.