American Ceramic Society/Electronics Division Lewis C. Hoffman Scholarships

The Lewis C. Hoffman Scholarship is a $2,000 undergraduate tuition award that is given to encourage academic interest and excellence in the area of ceramics/materials science and engineering. The 2018 essay topic is "Tailoring Material Properties through Defect Engineering for Electronic Ceramics." Deadline for applications is 15 May 2018.

Award Information

Award Amount
$2,000
Number of Awards
1
Application Deadline
May 15
Available to Class Level
None specified
Renewability
Not renewable

Eligibility Requirements

Minimum GPA Required
0
Ethnicity/Heritage
None specified
Residency
None specified
Gender
None specified
Religious Affiliation
None specified
Location of College
None specified
Area of Study
Materials Science, Engineering, and Metallurgy
Financial Need
Financial need analysis is not required

Scholarship Sponsor

Organization

American Ceramic Society
Address
Not reported
City, State, Zip
Not reported, ,
Telephone
Not reported
E-mail
Not reported
Website
Not reported

Data Source: Peterson’s Private Financial Aid Database, copyright © 2016 Peterson’s, a Nelnet company. All rights reserved.